Faculty and Staff

Jing Wang, PhD

Professor

  • 2024 and 2018 Faculty Outstanding Research Achievement Award
  • 2022 Excellence in Innovation Award
    Office: ENB 378

Phone: 813-974-6011

Email

Dr. Jin Wang

Research Interests

Dr. Wang's research interests are RF additive manufacturing for structural electronics and advanced packaging, phased array antennas and front-end systems, RF/microwave/millimeter-wave circuits, microwave acoustics, monolithic microwave integrated circuits (MMICs), micromachined transducers, RF/bio-MEMS, wireless sensors, flexible electronics, and functional nanomaterials.

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Biography

Dr. Jing Wang got dual M.S. degrees in Electrical Engineering and Mechanical Engineering and the Ph.D. degree from the University of Michigan, Ann Arbor, MI, USA, in 2002 and 2006, respectively. He has authored or co-authored more than 200 peer-reviewed articles and holds 14 U.S. patents. His research work has been funded by federal agencies (NSF, NIH, DoD, NASA, US Army, Army Research Lab, US Air Force, Air Force Research Lab, USSOCOM, DTRA, etc.) and many companies totaling over $24 M. His research interests are RF additive manufacturing for structural electronics and advanced packaging, phased array antennas and front-end systems, RF/microwave/Mm-wave circuits, microwave acoustics, monolithic microwave integrated circuits (MMICs), micromachined transducers, RF/bio-MEMS, wireless sensors, flexible electronics, and functional nanomaterials. Dr. Wang was a recipient of the 2024 and 2018 Faculty Outstanding Research Achievement Award and the 2022 Excellence in Innovation Award at the °®ÎŰ´«Ă˝.

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Publications

  1. R. Liu, G. Mitchell, W. J. D. Johnson, G. Mumcu and J. Wang, “Mm-Wave 3D Printed 2×2 Antenna Subarray with Structurally Packaged Beamforming IC and Thermal Management,” in IEEE Transactions on Components, Packaging and Manufacturing Technology (in press), doi: 10.1109/TCPMT.2025.3621409.
  2. R. Liu, D. Lan, R. A. Ramirez, B. Reams, L. Li, T. Weller and J. Wang, “Laser Enhanced Direct Print Additive Manufacturing (LE-DPAM) for Low-Loss, Low-Parasitic Heterogenous Integration of MMICs,” in IEEE Transactions on Components, Packaging and Manufacturing Technology, doi: 10.1109/TCPMT.2025.3610268.
  3. A. Pendino, N. Nguyen; S. E. Nouma, J. Wang, A. A. Yavuz; Y. Yilmaz and G. Mumcu, “Additively Manufactured RF Electronics With Structurally Integrated Physically Unclonable Functions for Wireless System Security,” in IEEE Access, vol. 13, pp. 145042-145059, 2025, doi: 10.1109/ACCESS.2025.3600010.
  4. U. Misra, V. Kosamiya, A. B. Anderson, L. Li , R. Liu, U. Guneroglu, I. Spanopoulos and J. Wang, “Investigation of Graphene Film as Ground Plane Material for RF and Microwave Electronics,” in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol.15, no. 5, pp. 1143-1150, May 2025, doi: 10.1109/TCPMT.2025.3537653.
  5. O. F. Firat, J. Wang and T. Weller, “Characterization of Additively Manufactured Suspended Finite Ground CPW Interconnects Enhanced by Femtosecond Laser Micromachining,” in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 14, no. 6, pp. 965-972, June 2024, doi: 10.1109/TCPMT.2024.3399750.
  6. V. Kosamiya and J. Wang, “Composite Feedstock Filaments for Fused Deposition Modeling (FDM) of Microwave Interconnects,” in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 13, no. 2, pp. 249-256, Feb. 2023.
  7. M. Abdin, W. J. D. Johnson, J. Wang and T. M. Weller, “W-Band MMIC Chip Assembly Using Laser-Enhanced Direct Print Additive Manufacturing,” in IEEE Transactions on Microwave Theory and Techniques, vol. 69, no. 12, pp. 5381-5392, Dec. 2021.
  8. D. C. Lugo, J. Wang and T. M. Weller, “Analytical and Experimental Study of Multilayer Dielectric Rod Waveguides,” in IEEE Transactions on Microwave Theory and Techniques, vol. 69, no. 4, pp. 2088-2097, April 2021. doi: 10.1109/TMTT.2021.3056433.
  9. U. Guneroglu, A. Zaman, A. Alsolami, I. F. Rivera and J. Wang, “Study of Frequency Trimming Ability and Performance Enhancement of Thin-Film Piezoelectric-on-Silicon MEMS Resonators by Joule Heating via Localized Annealing,” in IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, vol. 72, no. 5, pp. 686-696, May 2025, doi: 10.1109/TUFFC.2025.3556305
  10. T. Liu, X. Han, J. Pastrana, N. Sepúlveda and J. Wang, “Piezoelectric Lateral-Extensional Mode Resonators With Reconfigurable Electrode and Resonance Mode-Switching Behavior Enabled by a VO₂ Thin-Film,” in IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, vol. 69, no. 8, pp. 2512-2525, Aug. 2022, doi: 10.1109/TUFFC.2022.3156845.
  11. A. Zaman, A. Alsolami, I. F. Rivera and J. Wang, “Thin-Piezo on Single-Crystal Silicon Reactive Etched RF MEMS Resonators,” in IEEE Access, vol. 8, pp. 139266-139273, 2020. doi: 10.1109/ACCESS.2020.3012520.
  12. A. Zaman, U. Guneroglu, A. Alsolami, L. Li, and J. Wang, “Interface Material Modification to Enhance the Performance of a Thin-Film Piezoelectric-on-Silicon (TPoS) MEMS Resonator by Localized Annealing Through Joule Heating,” Micromachines, vol. 16, no. 8: 885. https://doi.org/10.3390/mi16080885
  13. L. Li, D. Lan, X. Han, T. Liu, J. Dewdney, A. Zaman, U. Guneroglu, C. M. Martinez, and J. Wang, “Low Phase Noise, Dual-Frequency Pierce MEMS Oscillators with Direct Print Additively Manufactured Amplifier Circuits,” Micromachines, vol. 16, no. 7: 755. https://doi.org/10.3390/mi16070755
  14. A. Zaman, A. Alsolami, M. Wei, I. Rivera, M. Baghelani, and J. Wang, “Lateral Extensional Mode Piezoelectric ZnO-on-Nickel RF MEMS Resonators for Back-End-of-Line Integration,” Micromachines, vol. 14, no. 5, May 2023: 1089. https://doi.org/10.3390/mi14051089.
  15. C. Molina, U. Guneroglu, A. Zaman, L. Li, and J. Wang, “Performance and Characterization of Additively Manufactured BST Varactor Enhanced by Photonic Thermal Processing,” Crystals, vol. 14, no. 11: 990. https://doi.org/10.3390/cryst14110990
  16. A. Alsolami, H. Hussain, R. Noor, N. AlAdi, N. Almalki, A. Kurdi, T. Tabbakh, A. Zaman, S. Alfihed, and J. Wang, “Recent Advances in Black Silicon Surface Modification for Enhanced Light Trapping in Photodetectors,” Applied Sciences, vol. 14, no. 21: https://doi.org/10.3390/app14219841
  17. A. Zaman, U. Guneroglu, A. Alsolami, and J. Wang, “Piezoelectrically and Capacitively Transduced Hybrid MEMS Resonator with Superior RF Performance and Enhanced Parasitic Mitigation by Low-Temperature Batch Fabrication,” Applied Sciences, vol. 14, no. 18: 8166. https://doi.org/10.3390/app14188166
  18. P. Lathiya, and J. Wang, “Enhancement in magnetic permeability of Ni-Co-Zn ferrites using CuO doping for RF and microwave devices,” Journal of the American Ceramic Society, vol. 105, no. 4, pp. 2678-2689. doi:10.1111/jace.18253.
  19. P. Lathiya and J. Wang, “Influence of Hydraulic Pressure on Dynamic Magnetic Properties of Ni-Cu-Zn Ferrites,” in IEEE Magnetics Letters, vol. 10, pp. 1-5, 2019, Art no. 7110505, doi: 10.1109/LMAG.2019.2957099.
  20. P. Lathiya and J. Wang, “Effects of the Sintering Temperature on RF Complex Permeability of NiCuCoZn Ferrites for Near-Field Communication Applications,” in IEEE Transactions on Magnetics, vol. 55, no. 2, pp. 1-4, Feb. 2019, Art no. 2800404, doi: 10.1109/TMAG.2018.2870885.
  21. P. Lathiya, M. Kreuzer, and J. Wang, “RF complex permeability spectra of Ni-Cu-Zn ferrites prepared under different applied hydraulic pressures and durations for wireless power transfer (WPT) applications,” Journal of Magnetism and Magnetic Materials, vol. 499, April 2020, 166273. https://doi.org/10.1016/j.jmmm.2019.166273
  22. D. C. Lugo, R. A. Ramirez, J. Wang and T. M. Weller, “Multilayer Dielectric End-Fire Antenna With Enhanced Gain,” in IEEE Antennas and Wireless Propagation Letters, vol. 17, no. 12, pp. 2213-2217, Dec. 2018, doi: 10.1109/LAWP.2018.2871103.
  23. A. Alsolami, A. Zaman, I. F. Rivera, M. Baghelani and J. Wang, “Improvement of Deep Reactive Ion Etching Process For Motional Resistance Reduction of Capacitively Transduced Vibrating Resonators,” in IEEE Sensors Letters, vol. 2, no. 1, pp. 1-4, March 2018, Art no. 5000104, doi: 10.1109/LSENS.2018.2797076.
  24. T. Wang , R. Green , R. Guldiken , J. Wang, S. Mohapatra, S. Mohapatra, “Finite Element Analysis for Surface Acoustic Wave Device Characteristic Properties and Sensitivity,” Sensors (Basel), 2019;19(8):1749. Published 2019 Apr 12. doi:10.3390/s19081749
  25. J. Castro, E. A. Rojas-Nastrucci, A. Ross, T. M. Weller, J. Wang, “Fabrication, Modeling, and Application of Ceramic-Thermoplastic Composites for Fused Deposition Modeling of Microwave Components,” in IEEE Transactions on Microwave Theory and Techniques, Vol. PP, No.99, pp.1-12, February 14, 2017, doi: 10.1109/TMTT.2017.2655057.
  26. K. H. Church, N. B. Crane, P. I. Defenbaugh, T. P. Ketterl, C. G. Neff, P. B. Nesbitt, J. T. Nussbaum, C. Perkowski, H. Tsang, J. Castro, J. Wang and T. M. Weller, “Multimaterial and Multilayer Direct Digital Manufacturing of 3-D Structural Microwave Electronics,” Proceedings of the IEEE, Vol. PP, No. 99, pp.1-14, February 13, 2017, doi: 10.1109/JPROC.2017.2653178.

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Honors And Awards

  1. 2025 Honorable Mention in the 2025 Outstanding Graduate Faculty Mentor Award
  2. 2024 USF Outstanding Research Achievement Award at °®ÎŰ´«Ă˝
  3. 2022 Excellence in Innovation Award at °®ÎŰ´«Ă˝
  4. 2018 USF Outstanding Research Achievement Award at °®ÎŰ´«Ă˝
  5. 2018 USF EE Department’s Educator of the Year Award
  6. Advisor of the Best Research Poster Award at 2024 and 2022 IEEE WAMI Forums
  7. Faculty Advisor of the Best Student Research Poster Award at IEEE WAMICON 2022
  8. Senior Member of National Academy of Inventors (NAI)
  9. IEEE MTT-s Microwave Engineering Graduate Fellowship (PhD Advisor)
  10. Best Poster Presentation Award of 21st International Conference on Magnetism

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Research Lab

The RF MEMS Transducers Group at USF, led by Prof. Jing Wang (Agere Systems Endowed Chair; Co-Director of WAMI Center), advances RF/microwave and mm-Wave hardware spanning additive manufacturing for structural electronics and advanced packaging; heterogeneous integration; phased-array antennas and front-end systems; MMICs; micromachined transducers; RF/bio-MEMS and microwave acoustics; wireless telemetry; and functional nanomaterials.
Our team includes 1 postdoc, 8 PhD, 3 MS, and 2 REU undergraduates. Since 2006, Prof. Wang has graduated 23 PhD and 8 MS students, fostered strong undergraduate participation through REU and senior design, co-authored 200+ peer-reviewed papers, and holds 14 U.S. patents. Group funding exceeds $25M from federal agencies and industry. Honors include USF Faculty Outstanding Research Achievement (2024, 2018) and Excellence in Innovation (2022) Awards. He chairs the IEEE WAMICON Executive Committee.

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Current Grants

  • Principal Investigator; Funding Agency: L3Harris and °®ÎŰ´«Ă˝ High Tech Corridor (FHTC); Co-Design and Additive Manufacturing of a 5G Phase Array Fed Lens Antenna; Project Period: 12/15/2023-12/31/2025.
  • Principal Investigator; Funding Agency: NSF Future of Semiconductors (FuSe); Collaborative Research: Fuse: Thermal Co-Design for Heterogeneous Integration of Low Loss Electromagnetic and RF Systems (The CHILLERS); Project Period: 9/01/2023-8/31/2026.
  • Co-PI and Ramesh Ayyala (PI); Funding Agency: The Assistant Secretary of Defense for Health Affairs endorsed by the Department of Defense (HT9425-23-1-0502); Artificial Cornea and Sensor-Based Continuous IOP Monitoring System to Treat Patients with Cornea Blindness Secondary to War-Related Ocular Injuries; Project Period: 9/01/2023-8/31/2026.
  • Principal Investigator; Funding Agency: ARL; PRANCE: 3D Integrated Antenna Arrays for High Precision Timing Estimation and Localization in GPS-Denied Jammed and Congested Spectral Environments; Project Period: 2/1/2024-1/31/2027.
    Co-PI (PI: G. Mumcu); Funding Agency: PRANCE: Additively Manufactured
  • Multidimensional Cryptographic Physically Unclonable Functions for Wireless System Security; Project Period: 2/1/2024-1/31/2027.
  • Co-PI (PI: G. Mumcu); Funding Agency: ARL; PRANCE: 3D Integrated Mm-Wave Reconfigurable Metasurfaces Using Laser-Enhanced Direct Print Additive Manufacturing (LE-DPAM); Project Period: 2/1/2024-1/31/2027.
  • Principal Investigator; USF/IAE sub-award; Funding Agency: US SOCOM Small Business Technology Transfer (STTR) Program; STTR Phase II - Collaborative Sensing and Identification using Autonomous Underwater Vehicles (AUVs) in a Mesh Network; Project Period: 10/15/2023-12/31/2025 (An additional FHTC match grant)
  • Principal Investigator, Funding Agency: ARL W911NF2020228, Laser-Enhanced Direct Print Additive Manufacturing (LE-DPAM) Enabled 3D Hybrid IC Electronics Packaging for High Performance and Low-Cost Active Phased Antenna Arrays, Project Period: 9/15/2020-12/31/2025.

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